How Do I Become a Refrigeration Mechanic?

Semiconductor cooling fins, also called thermoelectric cooling fins, are a type of heat pump. Its advantage is that there are no sliding parts, and it is used in some places with limited space, high reliability requirements, and no refrigerant pollution. Utilizing the Peltier effect of semiconductor materials, when direct current passes through a couple of two different semiconductor materials connected in series, the two ends of the couple can respectively absorb and release heat, which can achieve the purpose of cooling. It is a refrigeration technology that generates negative thermal resistance. It is characterized by no moving parts and high reliability.

Semiconductor cooling sheet

Semiconductor refrigeration chip, also called thermoelectric refrigeration chip, is a kind of

Semiconductor cooling fins are a kind of cooling device composed of semiconductors, which appeared only around 1960, but its theoretical foundation Peltiereffect dates back to the 19th century. This phenomenon was first discovered by a German scientist ThomasSeeback in 1821, but he made the wrong inference at that time and did not realize the real scientific principles behind it. In 1834, a French watchmaker and a part-time physicist JeanPeltier did not find out the real reason behind this phenomenon. This phenomenon did not have practical applications until recently with the development of semiconductors. Device "(note that this time it is called a refrigerator, not a semiconductor refrigerator). By many

In principle, a semiconductor cooling fin is a tool for heat transfer. When a current passes through a thermocouple pair formed by a piece of N-type semiconductor material and a piece of P-type semiconductor material, heat transfer occurs between the two ends, and heat is transferred from one end to the other end, which causes a temperature difference to form cold and heat. end. However, the semiconductor itself has resistance. When current passes through the semiconductor, heat is generated, which will affect heat transfer. In addition, the heat between the two plates will be reversely transferred through the air and the semiconductor material itself. When the cold and hot ends reach a certain temperature difference, when the two types of heat transfer are equal, an equilibrium point is reached, and the forward and reverse heat transfers cancel each other out. At this time, the temperature of the hot and cold ends will not continue to change. In order to achieve a lower temperature, heat dissipation can be adopted to reduce the temperature of the hot end.

The role of the fan and the heat sink is mainly to dissipate heat from the hot end of the cooling fin. Generally, the temperature difference between the cold and hot ends of a semiconductor refrigeration chip can reach 40 to 65 degrees. If the temperature of the hot end is reduced by active heat dissipation, the temperature of the cold end will also decrease accordingly, thereby reaching a lower temperature.

When an N-type semiconductor material and a P-type semiconductor material are connected to form a galvanic pair, after a DC current is connected in this circuit, energy transfer can occur, and the current flows from the N-type element to the joint of the P-type element to absorb heat. Become the cold end; the P-type element flows to the joint of the N-type element to release heat and become the hot end. The amount of heat absorption and heat release is determined by the current and the number of element pairs of the semiconductor materials N and P. The following three points are the temperature difference electrical effects of thermoelectric refrigeration.

Advantages and features

semiconductor

I. Correct installation and assembly methods:

1. One side of the cooling fin is a heat sink and the other side is a cooling system. The flatness of the mounting surface is not greater than 0.03mm, and burrs and dirt must be removed.

2. The cooling fins are in good contact with the radiating fins and cold-conducting blocks, and the contact surface must be coated with a thin layer of heat conduction

Computer cooling

Due to the increased heat generated by the frequency increase has been a problem discussed by overclockers, from

Nucleus
chip