What Is Heatsink Compound?

With the miniaturization of electronic products, the power has been reduced. The heat it generates is more and more, and it is necessary to dissipate the heat as soon as possible, and an aluminum alloy heat sink is added to the heating body. There is a gap between the heating element and the heat sink, which hinders the spread of heat. It needs to be filled with a thermally conductive substance to increase the heat dissipation effect. At the same time, the heat sink needs to be fixed on the heating element. The heat sink adhesive does exactly the same thing. Both thermally conductive and adhesively fixed.

Heat sink adhesive

Right!

With the miniaturization of electronic products, the power has been reduced. The heat it generates is more and more, and it is necessary to dissipate the heat as soon as possible, and an aluminum alloy heat sink is added to the heating body. There is a gap between the heating element and the heat sink, which hinders the spread of heat. It needs to be filled with a thermally conductive substance to increase the heat dissipation effect. At the same time, the heat sink needs to be fixed on the heating element. The heat sink adhesive does exactly the same thing. Both thermally conductive and adhesively fixed.

Chinese name

Heat sink adhesive

Exterior

White, gray, black, paste

Surface dry time

1 ~ 20

hardness

45

The heat sink adhesive is a mixture of room temperature cured silicone rubber and an insulating and thermally conductive material. Silicone rubber has excellent insulation, temperature resistance, aging resistance and adhesion properties. Oxygen-conducting powder is highly conductive and non-conductive.

Serial number		Test items	Performance	Testing method
1	Before curing	Exterior	White, gray, black, paste	Visual inspection
2		Surface drying time (min)	1 ~ 20	Finger touch measurement
3	After curing	Hardness (Shore A)	45	GB / T531-99
4		Elongation(%)	150 ~ 250	GB / T528-98
5		Tensile strength (MPa)	1.0	GB / T528-98
6		Adhesive strength (MPa)	1.4	GB / T528-98
7		Volume resistivity (.cm)	1.0 × 1013	GB / T1410-1989
8		Breakdown voltage (kv / mm)	15 ~ 25	GB / T1408.1-99
9		Dielectric constant (60Hz)	3.0	GB / T1409-1988
10		Dielectric loss factor (60Hz)	0.003	GB / T1409-1988

The thermal conductivity of Sili technology heat sink adhesive: 0.8-1.2w / mk.

1 Complete the heat transfer between the heat-generating and heat-dissipating parts, increase the heat conduction area, and also play the role of shock absorption, insulation, sealing, etc., which can meet the requirements of miniaturization and ultra-thin fanless design of the company's equipment. It is a very good industrial product. The heat-conducting material is very convenient to use. It tears off the protective film and is flexible. It completes the heat transfer between the heat-generating part and the heat-dissipating part.

2 Typical applications The products of Sili Technology's heat sink adhesive are widely used in:

Built-in power module, backlight module module, LED lighting switch, hub, network card, modem, transmission equipment, semiconductor lighting equipment, test / control medical instrument, power module, heating power devices (integrated circuits, The power tube, thyristor, transformer, etc.) and the heat dissipation facilities (heat sink, aluminum casing, etc.) are in close contact to achieve better thermal conductivity.