What Is an LGA Socket?
The GS-mark indicates "Passed Safety Inspection". GS-determined that the product complies with the German Equipment Product Safety Law, the Trade Union Safety Measures Regulation, the German Industrial Standard (DIN), the European Standard (EN) and the general technical standards. Before manufacturers are allowed to affix the GS-Mark and be granted the corresponding certification, their products must pass the tests of recognized testing agencies (such as LGA). To ensure the validity of this mark, annual inspections must also be performed.
LGA
- LGA: main testing certification mark
- Brief introduction: The "LGA qualified test" mark indicates that the product has passed the tests conducted in accordance with certain requirements (use performance, safety performance, and other relevant legal requirements) and meets current technical standards.
- In order for a manufacturer to obtain the "LGA Testing Qualified" mark, it must pass a corresponding assessment in accordance with the above requirements. To ensure the validity of this mark, LGA will conduct annual factory and product inspections of certified companies.
- LGA inspection qualified:
- LGA (land grid array)
- That is, a package with array-shaped electrode contacts is made on the bottom surface. Just plug in the socket during assembly. Ceramic LGAs with 227 contacts (1.27mm center distance) and 447 contacts (2.54mm center distance) are available for high-speed logic LSI circuits.
- Compared with QFP, LGA can accommodate more input and output pins in a smaller package. In addition, since the impedance of the leads is small, it is suitable for high-speed LSIs. However, due to the complicated manufacture and high cost of the socket, it is basically not used much now. Demand is expected to increase in the future.
- With the development of technology, LGA has been used by many manufacturers. Since 2004, INTEL has successively launched LGA775, LGA1155 and other new core CPUs.
- LGA physical map
- The new mobile processor I5 / I7 models that INTEL may launch at the end of 2012 are expected to re-use BGA packages. This means that these processors cannot be replaced like LGA-packaged processors and can never be removed from the notebook motherboard.