What Are the Different Types of Plating Equipment?

The surface conditions and processing requirements during electroplating. Select the appropriate steps to perform the necessary trimming on the surface of the part to make the part have a smooth and smooth surface. This is an important part of obtaining a high-quality coating. In the pre-plating process, the main equipment used are grinding, polishing, brushing, sandblasting, rolling and various types of fixed grooves. Electroplating is the main process in the entire production process. According to the requirements of the parts, one or more single metal or alloy electroplating processes are selected to perform electroplating or immersion plating on the parts in order to achieve the purposes of corrosion prevention, wear resistance and beautiful appearance. The equipment used in the plating process mainly includes various types of fixed tanks, barrel plating tanks, hangers, hanging baskets, etc. Post-plating treatment is to polish, light, passivate, color, dry, seal, and dehydrogenate the part. Select one or more procedures to make the part meet the quality requirements. Common equipment for post-plating treatment are grinding, polishing machines, various fixed grooves, etc.

Electroplating equipment

The surface conditions and processing requirements during electroplating. Select the appropriate steps to perform the necessary trimming on the surface of the part to make the part have a smooth and smooth surface. This is an important part of obtaining a high-quality coating. In the pre-plating process, the main equipment used are grinding, polishing, brushing, sandblasting, rolling and various types of fixed grooves. Electroplating is the main process in the entire production process. According to the requirements of the parts, one or more single metal or alloy electroplating processes are selected to perform electroplating or immersion plating on the parts in order to achieve the purposes of corrosion prevention, wear resistance and beauty. The equipment used in the plating process mainly includes various types of fixed tanks, barrel plating tanks, hangers, hanging baskets, etc. Post-plating treatment is to polish, light, passivate, color, dry, seal, and dehydrogenate the part. Select one or more procedures to make the part meet the quality requirements. Common equipment for post-plating treatment are grinding, polishing machines, various fixed grooves, etc.

Chinese name

Electroplating equipment

Foreign name

Plating equipment

Electroplating refers to a surface processing method in which a cation of the metal to be plated is used as a cathode in a salt solution containing the metal to be plated, and the cations of the metal to be plated in the plating solution are deposited on the surface of the substrate metal by electrolysis. . The coating performance is different from the base metal and has new features. According to the function of the coating, it is divided into protective coating, decorative coating and other functional coatings.

The research and development, design, manufacturing, sales and service of electroplating equipment and ultrasonic cleaning equipment are integrated. Electroplating is an electrochemical process and a redox process. The basic process of electroplating is to immerse parts in a solution of metal salt as the cathode The metal plate is used as the anode. After connecting the DC power supply, the required plating is deposited on the part.

For example: when nickel plating, the cathode is the part to be plated, and the anode is a pure nickel plate. The following reactions occur at the cathode and anode respectively:

Cathode (plating): Ni2 ++ 2e Ni (main reaction)

2H ++ 2e H2 (Side reaction)

Anode (nickel plate): Ni 2e Ni2 + (main reaction)

4OH-4e 2H2O + O2 + 4e (side reaction)

Not all metal ions can be deposited from an aqueous solution. If the side reaction of reduction of hydrogen ions to hydrogen on the cathode is dominant, metal ions are difficult to precipitate on the cathode. According to experiments, the possibility of metal ions being electrodeposited from aqueous solutions Certain rules can be obtained from the periodic table of elements, as shown in Table 1.1.

The anodes are divided into soluble anodes and insoluble anodes. Most anodes are soluble anodes corresponding to the plating layer, such as: zinc anodes for zinc plating, silver anodes for silver plating, and tin-lead alloys for tin-lead alloy anodes. Due to the difficulty of dissolving the anode, insoluble anodes are used. For acid gold plating, platinum or titanium anodes are mostly used. The main salt ions of the plating solution are supplemented by adding a prepared standard gold-containing solution. The chromium-plated anodes use pure lead, lead-tin alloy, Insoluble anodes such as lead-antimony alloys.

1. There should be good adhesion between the plating layer and the base metal, and between the plating layer and the plating layer.

2. The coating should be fine, smooth and uniform in thickness.

3. The coating shall have a specified thickness and as few pores as possible.

4. The coating should have all the specified indicators, such as brightness, hardness, and electrical conductivity.

5. The plating time and the temperature of the plating process determine the thickness of the coating.

6. The ambient temperature is -10 60 .

7. The input voltage is 220V ± 22V or 380V ± 38V.

8. The maximum working noise of water treatment equipment should not be greater than 80dB (A).

9. Relative humidity (RH) should not be greater than 95%.

10. The COD content of raw water is 100mg / L 150,000mg / L.

Electroplating, also known as electrodeposition, is one of the main methods for obtaining metal plating on the surface of materials. It is a process in which the anode and the cathode form a loop in the electrolyte solution (plating solution) under the action of a direct-current electric field, so that metal ions in the solution are deposited on the surface of the cathode plating; Current efficiency: the amount of electricity used to deposit the metal accounts for the total The ratio of electricity is called the current efficiency of the plating.

Dispersion ability : The dispersion ability of the plating solution refers to the ability of the deposited metal to be uniformly distributed on the surface of the cathode part under certain electrolytic conditions.

Alloy plating : The process of co-depositing two or more metal ions on the cathode to form a uniform and fine coating is called alloy plating (in general, its minimum composition should be greater than 1%).

Leveling ability : The leveling ability (that is, the ability to disperse microscopically) refers to the ability of the plating solution to make the microscopic profile of the plating layer smoother than the surface of the substrate when the plating layer is formed on the metal surface. It expresses that the roughness of the base metal is relatively small, the depth of the wave cavity is less than 0.5mm, and the uniformity of the distribution of the coating on the surface with a small distance between the wave peak and the valley.

Pinholes or pits : Hydrogen adheres to the surface of the cathode in the form of bubbles, preventing the metal from depositing in these areas. It can only be deposited around the bubbles. If the hydrogen bubbles have remained on the surface of the cathode during the entire plating process, the plating There will be voids or through gaps in the plating layer; if the hydrogen bubbles do not adhere firmly during the electroplating process, but instead escape and adhere intermittently, these areas will form shallow pits or pits, which are usually used in the electroplating industry. Call it a pinhole or pit.

Bubbling : After electroplating, when the temperature of the surrounding medium rises, the adsorbed hydrogen accumulated in the base metal will expand and cause small blisters in the coating, which seriously affects the quality of the coating. This phenomenon is particularly noticeable when electroplating metals such as zinc, cadmium, and lead.

Covering ability : Covering ability (or deep plating ability) is also an important performance index of the plating solution, which refers to the ability of the deposited metal to completely cover the surface of the cathode part under certain electrolytic conditions, that is, under certain conditions in the groove or deep The ability to deposit a metal coating in a hole, which refers to the completeness of the distribution of the coating on the part.

Hydrogen embrittlement : After the reduction of the cathode, part of the hydrogen ions form hydrogen to escape, and part of it penetrates into the base metal (especially high-strength metal materials) and the coating in the state of atomic hydrogen, which reduces the toughness of the base metal and the coating and becomes brittle. This phenomenon is called "hydrogen embrittlement".

In order to complete the plating process according to the process requirements, it is not enough to have a power source and a plating tank. It must also have some auxiliary equipment to ensure the normal production of plating. Includes heating or cooling equipment, cathode moving or stirring equipment, plating solution circulation or filtering equipment, and necessary accessories for plating tanks such as electrode rods, electrode leads, anodes and anode baskets,

The equipment needed for electroplating is mainly rectifier power,

I. Brush plating equipment and solution: The dedicated power source is the main equipment for brush plating. It uses a DC power supply with stepless voltage regulation. The common voltage range is 0-50V.

The plating pen is the main tool for brush plating and is composed of a handle and an anode. The anode is the working part of the galvanized pen. Graphite and platinum alloy are ideal insoluble anode materials, but graphite is most widely used. Platinum and iridium alloys are only used when the anode size is very small and graphite cannot be used. Wrap absorbent cotton wrap on graphite anode, its function is to store

(1) First dissolve sodium thiosulfate (or ammonium thiosulfate) with a part of water.

(2) Dissolve silver nitrate and potassium metabisulfite separately in anodizing equipment in distilled water and mix under constant stirring. At this point, a precipitate is formed. Immediately add a solution of sodium thiosulfate (or ammonium thiosulfate) and keep stirring to completely dissolve the white precipitate. Then add water to the required amount.

(3) Expose the prepared plating solution to sunlight for several hours, add O. 5g / L of activated carbon, filtered to obtain a clear liquid.

Composition of additives SL-80 additive is a condensation product of nitrogen-containing organic compound and epoxy group-containing compound. The use of this additive does not increase the hardness of the coating. The consumption of SL-80 additive was 100 mL / (kA.h).

(4) Process characteristics The silver plating process has large current density, bright and delicate coating, temperature range shearing, fixed, deep plating ability and dispersion ability can be similar to the cyanide silver plating process.

(5) Precautions During the preparation process, special attention should be paid to adding silver nitrate directly to the sodium thiosulfate (or ammonium sulfate) solution, otherwise the solution will easily become black. Because silver nitrate interacts with thiosulfate, a colored silver thiosulfate precipitates first, and then it gradually hydrolyzes into black silver sulfide.

The newly prepared plating solution may be slightly yellow or have a small amount of turbidity or precipitation, which can be cleared after filtering. Electrolysis can be performed for a certain period of time before the trial plating. At this time, a black film may appear on the anode, which can be brushed with copper wire, and the anode area is appropriately increased to reduce the anode current density.

The silver ion in the tin plating solution must be carried out according to the procedure of the preparation method, and silver nitrate cannot be directly added to the plating solution. At the same time, the amount of potassium pyrosulfite in the plating solution was kept within the normal range. Because of its existence, it is beneficial to the stability of sulfur sulfate. Otherwise, the reaction of thiosulfate precipitation of sulfur occurs, and the precipitation of sulfur is very unfavorable to silver plating.

The advantages of using membrane separation technology for electroplating and rinsing water treatment mainly include the following aspects:

1. Reuse of wastewater, reducing the amount of rinsing water, which can be further processed to achieve the zero discharge of wastewater, reducing the scale of biochemical and physical and chemical treatment, which is conducive to the expansion of production needs of enterprises

2. Useful metal ions can be recovered, enabling enterprises to generate benefits while achieving environmental protection purposes;

3. The effluent quality of the membrane is good and transparent, which is higher than the process water requirements of the electroplating industry;

4. Short payback period and low risk;

5. It can be designed according to the processing requirements, and can be continuously expanded to increase the processing capacity and improve the processing capacity through continuous optimization;

6. The system is easy to operate and covers a small area.

· Traditional electroplating wastewater treatment methods: chemical method, ion exchange method, electrolytic method, etc.

· Problems faced by traditional methods in treating electroplating wastewater:

(1) Cost is too high-water cannot be recycled, and water and sewage treatment costs account for 15% to 20% of total production costs;

(2) Waste of resources-precious metals are discharged into water bodies and cannot be recycled;

(3) Environmental pollution-heavy metals in electroplating wastewater are "permanent pollutants", which are transferred and accumulated in the biological chain, and endanger human health.

1. It has good economic benefits, and the initial cost can be recovered within 1-3 years.

2. 75% -90% of circuit board and electroplating plant wastewater is recycled.

3. The recovered water quality is stable below 200us / cm.

4. Wastewater recycling costs can be reduced.

5. In the industrial zone when the water is limited or scarce, this recycling equipment can be used to ensure production.

6. The factory expands production without increasing wastewater treatment equipment and emissions.

7. Fully automatic continuous system is suitable for large-flow wastewater recovery.

8. The recovered water can be supplied to the pure water system or directly reused to the production line.

Electroplating equipment