What Is a Fiberglass Panel?

Glass fiber board, also known as glass fiber board, is generally used for soft-covering the base layer, and then covered with fabric, leather, etc. to make beautiful wall and ceiling decoration. The application is very extensive. With sound absorption, sound insulation, heat insulation, environmental protection, flame retardant and so on.

Glass fiber board alias: glass fiber insulation board, glass fiber board (FR-4), glass fiber composite board, etc., made of glass fiber material and high

Main technical characteristics and application of white FR4 light board: stable electrical insulation performance,

Among epoxy resin glass fiber boards, FR-4 glass fiber boards have always maintained their absolute advantages and dominance, occupying most of the high-end market, and the main reason is that FR-4 integrates various industrial properties in one. And has high flame resistance, so it is well received by the market.

FR-4 resin glue

(1) Resin glue formula In the epoxy resin glass fiber board industry, FR-4 glass fiber boards have been produced for many years. The resin glue formula is basically the same.

(2) Preparation method: 1) Dimethylformamide and ethylene glycol methyl ether are stirred and mixed to prepare a mixed solvent. 2) Add dicyandiamide and stir to dissolve. 3) Add epoxy resin and stir. 4) 2 -methylimidazole is previously dissolved in an appropriate amount of dimethylformamide, and then added to the above materials, and continued to be fully stirred. 5) After being parked (aged) for 8 hours, the technical requirements related to sampling and testing.

(3) Technical requirements of resin glue: 1) Solid content 65% ~ 70%. 2) Gel time (171 ° C): 200-250s.

Adhesive sheet

(1) Manufacturing process After the glass fiber cloth is unrolled, it enters the glue tank through the guide roller. After dipping, the resin content is controlled by the squeeze roller, and then it enters the oven. During the oven, volatiles such as solvents are removed while the resin is in a semi-cured state. After leaving the oven, cut according to the size requirements and stack them neatly on the storage rack. Adjust the gap of the squeeze roller to control the resin content. Adjust the temperature, air volume and vehicle speed of each temperature zone of the oven to control the gel time and volatile content.

(2) Testing method In the manufacturing process of the adhesive sheet, in order to ensure the quality, various technical requirements must be tested regularly. The detection method is as follows:

1) Resin content: At least 25mm of the edge of the adhesive sheet, cut 3 samples in the width direction left, center and right The sample size is 100mm × 100mm, and the diagonal line is parallel to the warp and weft directions. Weigh one by one (W1), accurate to 0.001g. Put the sample in a 524-593 (Maf furnace) and burn it for more than 15 minutes, or burn it until all carbides are removed. Move the sample to a desiccator and cool to room temperature. Weigh one by one (W2), Accurate to 0.001g. Calculation: resin content = [(W1-W2) / W1] × 100%.

2) Gel time: Cut a sample of about 20cm × 20cm from the center of the adhesive sheet, knead the sample so that the resin powder falls in a metal sieve, and then sieve it onto a clean white paper. Take about 20mg of resin powder and place it in the center of the detector's hot plate which has been heated up to 171 (± 0.5 ). When the resin powder is melted, start the stopwatch and stir the resin with a wooden toothpick. The elapsed time is the gel time.

3) Resin fluidity: Cut 4 samples at a distance of not less than 5 cm from the edge of the adhesive sheet. The sample size is 100mm × 100mm, and the diagonal line is parallel to the warp and weft directions. Weighing (W1), accurate to 0.005 grams. The samples are aligned and superimposed, a release film is added, and then placed between two stainless steel plates. Place the steel plate and the sample in a press at 170 ° C ± 2.8 ° C, and press once. The unit pressure is 1.4 MPa ± 0.2 MPa and hold for 10 minutes. Take out the sample and cool to room temperature. Punch a disc of 80mm from the center of the sample. Weigh the weight of the disc (W2), accurate to 0.005g. Calculation: mobility = [(Wl-2W2) / W1] × 100%.

4) Volatile content: At least 25mm away from the edge of the adhesive sheet, cut left, middle and right according to the width direction, and take 3 samples. The sample size is 100mm × 100mm, and the diagonal line is parallel to the warp and weft directions. At the corner of each sample, make a small hole. Put the sample in a desiccator and process it for 1h. Weigh one by one (W1), accurate to 0.001g. Hang the sample in an oven and bake at 163 ° C ± 2 ° C for 15min. Move the sample to a desiccator and cool for 10min. Weigh one by one (W2), accurate to 0.001g. Calculation: Volatile content = [(W1W2) / W1] × 100%

(3) Storage of adhesive sheet After the appearance and various technical indicators are tested, the adhesive sheet should be neatly stacked and stored as required. The epoxy resin in the adhesive sheet is in a semi-cured state. During the storage process, the quality of the adhesive sheet will change with the storage conditions and storage time. The change of the moisture absorption rate of the adhesive sheet under various relative humidity conditions shows that the moisture absorption rate of the adhesive sheet increases significantly when the relative humidity is large. The moisture absorption of the adhesive sheet will seriously affect the product quality, especially the dip solder resistance will be significantly deteriorated.

It can be seen that during the storage of the adhesive sheet, moisture resistance must be given full attention! In order to ensure product quality, it is necessary to emphasize that the adhesive sheet should be stored at a temperature below 25 ° C and a relative humidity below 50%.

pressing

The pressing process of epoxy resin copper clad board is roughly divided into three stages: heating, holding and cooling. The pressing process can be operated manually or controlled by a computer. In the heating stage, the heat is gradually transferred from the heating plate to each product between the layers, so that the resin melts and flows. At the same time, pressure is applied according to the melting and flowing of the resin. According to my many years of work experience, this stage is the key to the pressing process. If the pressure is not timely, it will cause "under pressure" and defects such as "micro-bubbles" and "dried flowers"; on the contrary, if the pressure is too early, it will cause the glue to flow. More problems like skateboarding.

Random polypropylene glass fiber board is a kind of semi-rigid board made of glass fiber hand-drawn thick wire as the main raw material, using random polypropylene as the binder in the petrochemical plant's scrap, and special process. In addition to all the characteristics of asphalt glass fiber boards, this board has a thermal conductivity of 20% lower. Because this board does not require petroleum asphalt, it uses waste from petrochemical plants, so product costs can be greatly reduced. "Double material" comprehensive utilization of products.

Compared with asphalt glass fiberboard, the rigid polypropylene fiberglass board is slightly less rigid, but it does not affect its performance. In order to keep the size stable and not deformed during transportation and storage, a layer of 5 can be applied to the surface of the board. The solution is a millimeter thick cement mortar protective layer. This can not only increase the rigidity of the board, but also facilitate the bonding with the structural layer wall ^[2] .