What is reactive spraying?

Reactive spraying is a change in the process of spraying plasma used to insert a thin film into a substrate material. In this process, the target material, such as aluminum or gold, is released into a chamber with an atmosphere made from a positively charged reactive gas. This gas forms a chemical bond with the target material and is applied to the substrate material as a compound.

While normal plasma spraying takes place in a vacuum chamber, which was abolished atmosphere, reactive spraying in a vacuum chamber with a low -pressure atmosphere composed of reactive gas. Special pumps on the machine remove the normal atmosphere, which is, among other things, carbon, oxygen and nitrogen and fill the chamber with gas such as argon, oxygen or nitrogen. Reactive gas in the reactive spraying process has a positive charge.

The target material such as titanium or aluminum is then released into the chamber, also in the form of GAS, and exposed to a magnetic field with high intensity. This field changes the target mateRial on negative ion. The negatively charged target material is attracted by a positively charged reactive material and two elements are connected before settling on the substrate. In this way, thin films can be made of compounds such as titanium nitride (tin) or aluminum oxide (Al2o3).

Reactive spraying significantly increases the speed at which a thin film can be made from the compound. While traditional plasma spraying is suitable when creating a thin film from a single element, the folded films take a long time. Increasing chemicals to binding as part of a thin film process helps to speed up the speed at which they settle on the substrate.

The pressure inside the reactive spray chamber must be carefully managed to maximize the growth of a thin film. At low pressures, Filmvoj takes a long time. In high pressures, reactive gas can "bother" the target surface that is when the target material gets its negative impairmentOJ. This not only reduces the growth rate for a thin film on the substrate below, but also increases the speed of poisoning; The less negative particles are, the less chemical bonds that can be formed with a positively charged reactive gas and therefore reactive gas is to poison the target surface. Monitoring and adjusting pressure in the system helps prevent this poisoning and allows the growth of thin film rapidly.