What is a diffuse barrier?

The

diffusion barrier is usually a thin coating of material used to prevent diffusion. Diffusion occurs when the molecules move from the area of ​​high concentration into the low concentration area, so that both areas occur. The diffusion happens whether the molecules are in gas, liquid or in a solid state and can lead to contamination of one product by another. These types of barriers are used in various commercial applications, so efficient and cheap barriers are very popular, especially in the electronic industry. Although there are barriers to oxygen and hydrogen diffusion, most diffusion barriers are metals. The thinner decomposition barrier USion and the more uniform the coating, the more effective the barrier. Metals in the barrier must be unreactive to the materials around it, so that the metals to protect the barrier should not be discussed and damaged. In addition, the diffuse barrier must be able to maintain strongly what it protects to provide a safe barrier that completely prevents diffusion to any molecule.

The various materials used to produce diffusion barriers offer different benefits and attention must be paid to optimizing the thickness, reactivity and adherence to the barrier. Metals differ in their reactivity and adherence, some of which provide a high degree of unreactivity, but low adherence, or vice versa. Some barriers may have multiple layers that meet the need for unreactive and adhesive metals. Alternatively a combination of metals called alloy, MK creation of a barrier. Several metals, including aluminum, chrome, nickel, tungsten and manganese, were used to create diffusion barriers.

diffuse barriers are commonly used in electronics for decades. They are used to maintain the integrity of internal copper from the silica oxide that surrounds it. This serves to extend the life of the electronic device by preventing the perimeter that would occur if copper and silica dioxide came into contact. TechNiology for creating and storing diffuse barriers has so far enabled increased speed of consumer electronics; For use in new generations of electronics, however, new alloys and techniques of deposition barriers are examined.