What are the different types of semiconductor packages?
Integrated circuits can be found in many forms on the plate (PCB). They are available both through holes and surface packages, although in the 21st century the surface packaging prevails. Global standards have been set up for different types of semiconductor packages, including the standards of the Council for Electronics Engineering (Jedec) and the Japanese Association of Electronics and Information Technology (JEITA). The most common package types include a grid field, a plastic quad with a flat package (QFP), one inline package (SIP), dual inline package (DIP), J-bed, small outline (SO) package and ground grid (LGA). The plastic PGA is in the shape of a square and the pins are arranged in this configuration on the underside. It is commonly used for microprocessors, but perhaps one of the most common formats of the ceramic ball (BGA), a package that is mounted on the PCB over the solder balls on the underside. BGA format can support thousands of balls or connections; meets high input-access requirements (I/O); and is designedFor efficient heat scattering and electrical output, because the distance between the field, die and the board is short.
A similar type of semiconductor packaging is a plastic QFP, with the exception of lead pins extending from L -shaped sides. There are rectangular and square versions of QFP with several hundred wires and packages classified for fine spacing, cooler, metric and thin configuration. There is also a rectangular package of the surface called Small J-Lead outline package. The J -shaped shells are bent back to the body of the package, which are often used for memory chips.
As QFP, SO Semicoductor Packaging has pins that extend in the shape of L from the sides, and are sold in a wide range of small classifications based on width and pin. SIP, incorporating up to several dozen pins, has pins over the holes on one side and stand upright on the PCB. This package is commonly used in a network of resistors on de deSCE. When immersion, the lead pins are located on both sides. Standard, ceramic and glass versions are available.
LGA package is another type of configuration. Lead pegs or solder balls are not used either. Metal pads are arranged in the grid over the lower surface and can have a number to more than 1600. Like the BGA package, LGA is also suitable for use in high I/O applications.