What Is a PGA Socket?

PGA package, the English name is (Pin Grid Array Package), the Chinese meaning is pin grid array packaging technology, the chip packaged by this technology has multiple square matrix pins inside and outside, each square matrix The periphery of the chip is arranged at a certain distance. Depending on the number of pins, it can be surrounded by 2 to 5 turns. During installation, plug the chip into a dedicated PGA socket.

PGA package

PGA package pin grid

The pin grid array packaging technology PGA (Ceramic Pin Grid Array Package), the chip packaged by this technology has multiple square matrix pins inside and outside. Depending on the number of pins, you can make 2 to 5 turns. During installation, plug the chip into a dedicated PGA socket. In order to make the CPU more convenient to install and remove, starting from the 486 chip, a ZIF CPU socket appeared, which is specifically used to meet the requirements of the PGA packaged CPU for installation and removal. This technology is generally used in situations where the plug-in operation is relatively frequent.

PGA package display pins

PGA package The display pin package PGA (pin grid array) is a plug-in package. The vertical pins on the bottom surface are arranged in a display shape, and the pin length is about 3.4mm. Surface mount PGAs have display pins on the bottom surface of the package, and their lengths range from 1.5mm to 2.0mm. The PGA package diagram is shown in the figure. Most are ceramic PGAs for high-speed large-scale logic LSI circuits. higher cost. The center distance of the pins is usually 2.54mm, and the number of pins ranges from 64 to 447. In order to reduce costs, the packaging substrate can be replaced with a glass epoxy printed substrate. There are also plastic PG A with 64 to 256 pins.

In addition, there is also a short-lead surface-mount PGA (butt-welded PGA) with a lead center distance of 1.27mm. The placement method uses a method of bump welding with a printed circuit board, so it is also called bump welding PGA. Because the center distance of the pins is only 1.27mm, which is half smaller than the plug-in type PGA, the package body can not be made much, and the number of pins is more than that of the plug-in type (250 to 528). . The base material of the package is a multilayer ceramic substrate and a glass epoxy printing base. Packaging using multilayer ceramic substrates has become practical.