What Are the Industrial Uses of Phosphorus Copper?

Phosphor bronze (phospho bronze) (tin bronze) (tin-phospho bronze) is made of bronze by adding a degassing agent with a P content of 0.03 to 0.35%, a tin content of 5 to 8%, and other trace elements such as iron Fe, zinc Zn, etc. Good fatigue resistance can be used for electrical and mechanical materials, the reliability is higher than general copper alloy products.

Phosphorous copper, an alloy of phosphorus and copper. It is used to reduce brass and bronze alloys instead of pure phosphorus, and used as phosphorous in the manufacture of phosphor bronze. It is divided into 5%, 10% and 15% grades and can be added directly to molten metal. Its role is a strong reducing agent, and phosphorus makes the bronze hard. Even adding a small amount of phosphorus to copper or bronze can increase its fatigue strength. To make phosphorous copper, a block of phosphorous is pressed into the molten copper until the reaction stops. Phosphorus is soluble when the proportion of copper is within 8.27%, forming Cu ₃ P, and its melting point is 707 ° C. The melting point of phosphorous copper containing 10% phosphorus is 850 ° C, and the melting point of 15% phosphorus is 1022 ° C. Above 15%, the alloy is unstable. Phosphor bronze is sold in grooved pieces or granules. In Germany, in order to save copper, phosphor zinc is used instead of copper copper. Metal phosphorus (metaIlophos) is the name of German phosphorus zinc containing 20-30% phosphorus. Commercial copper reduced with phosphorus, and the phosphorus content of which is less than 0.50% is also called phosphor copper. Although the conductivity decreased by about 30%, hardness and strength increased. Phosphor tin is the master alloy of tin and phosphorus, which is used in melting bronze to make phosphor bronze. Phosphorus tin usually contains more than 5% phosphorus, but does not contain lead. It looks like antimony, is a larger crystal, shiny. Sold in flakes. According to the requirements of the US federal regulations, it contains 3.5% phosphorus and the impurities are less than 0.50%. ^[1]

Tin phosphor bronze has higher corrosion resistance, wear resistance, and no sparks when impacted. For medium speed and heavy load bearings, the maximum working temperature is 250 . With automatic self-aligning, it is not sensitive to deflection, the bearing bears high uniform bearing capacity, can bear radial load at the same time, and self-lubricating without maintenance. Tin phosphor bronze is an alloy copper with good electrical conductivity, not easy to generate heat, ensuring safety, and strong fatigue resistance. The tin-phosphor bronze jack reed has hard-wired electrical structure and no rivet connection or friction contact, which can ensure good contact, good elasticity, and stable insertion. This alloy has excellent machining performance and chip formation performance, which can quickly shorten the part processing time.

QSn6.5-0.1

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Electrical industry applications

The electronics industry is an emerging industry, and in its booming development process, it has continuously developed new steel products and new application fields. Its applications have evolved from electrical vacuum devices and printed circuits to microelectronics and semiconductor integrated circuits.

Electric vacuum device

Electric vacuum devices are mainly high-frequency and ultra-high frequency transmitting tubes, waveguides, magnetrons, etc. They require high-purity oxygen-free copper and diffusion-strengthened oxygen-free copper.

Printed circuit

The copper printed circuit is made of copper foil as a surface and pasted on a plastic plate as a support; the circuit wiring diagram is printed on a copper plate by photography; the excess parts are removed by etching to leave interconnected circuits. Then, punch a hole on the printed circuit board's connection with the outside, insert the joints of the discrete components or the terminals of other parts, and solder on this opening, so that a complete circuit is assembled. If dip plating is used, all joints can be welded at one time. In this way, for those occasions that require fine arrangement of circuits, such as radios, televisions, computers, etc., the use of printed circuits can save a lot of labor in wiring and fixing circuits; therefore, they are widely used and require a large amount of copper foil to be consumed. In addition, in the connection of the circuit, various copper-based brazing materials with low cost, low melting point and good fluidity are needed.

integrated circuit

The core of microelectronics technology is integrated circuits. An integrated circuit is a micro-miniaturized circuit that uses semiconductor crystal materials as a substrate (chip) and integrates the components and interconnections that make up the circuit inside, on, or on the substrate using a special process technology. This microcircuit is thousands of times smaller in size and weight than the most compact discrete component circuit in structure. Its appearance caused great changes in computers and became the basis of modern information technology. The ultra-large-scale integrated circuit that has been developed has a number of transistors that can reach 100,000 or more on a single chip area smaller than Xiaomu's nails. The internationally renowned computer company IBM (International Business Machines Corporation) has adopted steel instead of aluminum in silicon chips as interconnect lines, and has made breakthrough progress. This new microchip using copper can achieve a 30% efficiency gain, the line size of the circuit can be reduced to 0.12 microns, and the number of transistors integrated on a single chip can reach 2 million. This created a new situation for the application of ancient metal copper in the latest technology field of semiconductor integrated circuits.

Lead frame

In order to protect the normal operation of integrated circuits or hybrid circuits, it is necessary to package it; and when packaging, a large number of connectors in the circuit are led out of the sealed body. These leads are required to have a certain strength, and the supporting skeleton constituting the integrated package circuit is called a lead frame. In actual production, for high-speed mass production, lead frames are usually stamped continuously on a metal strip in a specific arrangement. The frame material accounts for 1/3 to 1/4 of the total cost of the integrated circuit, and the amount is large; therefore, it must have a low cost.

Copper alloys are inexpensive, have high strength, electrical and thermal conductivity, excellent processability, pin weldability and corrosion resistance. Through alloying, their performance can be controlled in a wide range, which can better meet the performance of lead frames It has become an important material for lead frames. It is currently the most widely used material in microelectronic devices. ^[4]