What is involved in the production of integrated circuits?
Integrated circuit production includes the process of creating very thin surface layers of semicondurative material at the top of the substrate layer, usually made of silicon, which can be chemically changed to the atomic level to create the functionality of various types of circuits, including transistors, capacitors, resistors and diodes. It is progress compared to previous designs of circuits, where individual components of resistors, transistors and others were manually connected to the connecting board to form complex circuits. The integrated process of circuit production works with components that are so small that billions of them can be created in the area of several square centimeters since 2011 through various photographic lithography and etching in microchip production.
Integrated circuit, or IC, chip is literally a layer of semicondurative material where all component circuits are connected in one rowprocesses, so all components no longer have to be manufactured individually and assembled later. The earliest form of the integrated circuit of the microchip was made in 1959 and was a raw set of several dozen electronic components. However, the sophistication of the integrated circuit production increased exponentially with hundreds of components on IC chips until the sixties and thousands of components until 1969, when the first real microprocessor was created. Since 2011, electronic circuits have had several centimeters or widths that can hold millions of transistors, capacitors and other electronic components. Since 2011, microprocessors for computer systems and memory modules that contain mostly transistors have been the most sophisticated form of IC chips and may have billions of components per square centimeter.
Because components in the production of an integrated circuit are so small, the only effective way to create chemical etching processes that include reactions on the wafier surfaced exposure to light. For the perimeter there is a mask or a type of pattern and light is on the surface of a wafer, which is covered with a thin layer of photoresist material. This mask allows the patterns to be reached into the wafer photoresist, which is then baked at a high temperature to solidify the formula. The photoresist material is then exposed to the dissolution of the solution that removes either the irradiated area or the masked surface of the surface depending on whether the photoresist material is a positive or negative chemical reactant. The fine layer of interconnected components at the wool length of the light used remained behind, which can be either ultraviolet light or X -rays.
After camouflage, integrated circuit production involves doping of silicon or implantation of individual atoms usually phosphorus or borons on the material surface, which gives local areas on the crystal positive or negative electric charge. These charged areas are known as p and n regions and where they meet, TVThey cut the transmission intersection to create a universal electrical component known as the PN intersection. Since 2011, such intersections have been about 1,000 to 100 nanometers wide for most integrated circuits, which makes every connection of a PN of human red blood cells, which has a width of about 100 nanometers. The PN intersection process is chemically adapted to show different types of electrical properties, allowing the intersection to function as a transistor, resistor, capacitor or diode.
Due to the very fine level of components and connections between components on integrated circuits, when the process breaks up and there are defective components, the entire wafer must be fired because it cannot be repaired. This level of quality control is increased to an even higher level of the fact that the modern IC bridge since 2011 consists of many layers of integrated circuits stacked on top of each other and connected to create the final chip and provide more processing performance. Between each layerThe perimeter of the perimeter must also be placed insulating and metal interconnection layers and to make the circuit functional and reliable.
Although many rejected chips are produced in the integrated circuit production process, those that act as final products that pass through electrical testing and inspection of a microscope are so valuable that this process makes highly profitable. Integrated circuits now control almost every modern electronic device used since 2011, from computers and mobile phones to consumer electronics such as television, music players and gaming systems. They are also necessary components of car and aircraft driving systems and other digital devices that offer the user level of programming capacity, from digital alarms to nmental envirotermostats.