What is a wafer package?

Packaging at the wafer level concerns the production of integrated circuits by applying the packaging around each perimeter in front of the wafer to which they are produced is divided into individual circuits. This technique has grown rapidly in popularity in the integrated district industry due to the benefits of component, time and production costs. The component made in this way is considered to be the type of chip scale. This means that its size is almost the same as the size of the matrix inside on which the electronic circuits are located. Pure silicon ingot is usually cut into thin slices, called plates, which serve as a foundation on which microelectronic circuits are built. These circuits are separated by a process known as a cat of wafers. Once separated, they are wrapped in individual components and solders are available on the package.

The wafer packaging differs from conventional production in how the package is applied. Rather than distributing circuits apart and then for the use of a package and inThe diary before continuing to test this technique is used to integrate multiple steps. The upper and lower part of the package and the soldiers wires are applied to each integrated circuit in front of the bone circuit. Testing also usually takes place in front of a wafer stroller.

As well as many other types of conventional components, integrated circuits made with a wafer package are a type of surface technology. The surface devices are applied directly to the surface of the circuit plate by melting the solder balls connected to the component. The wafer level components can usually be used similarly to other devices on the surface. For example, they can often be purchased on reels for tapes for use in automated componuses Nent located as Pick and Place Machines.

with a package of wafer packages can be achieved by a number of economic benefits. Allows the integration of production, packaging and wafer testing to streamlineE production process. The shortened production cycle has increased production throughput and reduces the cost of the unit produced.

The wafer package also allows a reduced package size, which saves the material and further reduces production costs. Even more important, however, is that the reduced package size allows you to use components in a wider range of advanced products. The need for a smaller component size, especially reduced package height, is one of the main market controls packaging at the wafer level.

components made by packaging at the plate level are greatly used in consumer electronics such as mobile phones. This is largely due to market demand for smaller, lighter electronics that can be used in a way that is increasingly complaining. For example, many mobile phones are used for different features beyond simple calls such as shooting or video recording. Packaging at the wafer level is also used in various other applications. For example, they are used in sysAmi -monitoring pressure in the automotive industry, implantable medical devices, military transmission systems and more.