What Are Multi-Layer Boards?

The manufacturing method of the multilayer board is generally made by the inner layer pattern first, and then made into a single-sided or double-sided substrate by the printing etching method, and is incorporated into the designated layer, and then heated, pressurized, and bonded. Drilling is the same as the plated through hole method for double sided panels.

At the beginning, the multilayer board was disclosed with three manufacturing methods: Clearance Hole, Build Up, and PTH. The clearance hole method is labor-intensive in manufacturing and limited in density, so it is not practical. The build-up method is relatively complicated due to the manufacturing method, and although it has the advantage of high density, but because the demand for high density is not as urgent as it has come, it has been unknown;

There is an increasing demand for high-voltage equipment in various industries. However, in actual production, there are many unavoidable inherent defects in high-pressure equipment, such as frequent fluctuations in the use environment, high temperature, low temperature, pressure, and highly corrosive media. Welding processes and operating techniques may also cause defects such as undercuts, dents, weld knobs, pores, slag inclusions, cracks, incomplete penetration, unfusion, misaligned edges, corner distortion, and excessively high residual heights. The advent of multi-layer board wrapping technology will greatly reduce the occurrence of such accidents. In recent years, the rapid development of China's industry has significantly increased the technical requirements for large-scale and high-parameterization of pressure vessel products. At present, large pressure vessels include single-layer plate welding, single-layer forging welding, multi-layer wrapping, multi-layer tape winding, multi-layer winding, multi-layer winding, multi-layer winding, and multi-layer hot-sleeve. Among these, the manufacturing of multi-layer bandage pressure vessels is the most widely used, because its process is safe and reliable, so it is widely used. ^[1]

With the development of miniaturization and high integration of VLSI and electronic components, multi-layer boards are mostly moving in the direction of matching high-function circuits. Therefore, there is an increasing demand for high-density circuits and high wiring capacity. The characteristics (such as Crosstalk, integration of impedance characteristics) are more stringent. The popularity of multi-pin parts and surface-mounted components (SMD) has made the shape of circuit board circuit patterns more complex, conductor lines and apertures smaller, and the development of high multilayer boards (10-15 layers) has become popular. . In the second half of the 1980s, in order to meet the trend of high-density wiring and small holes to meet the needs of small size and light weight, 0.4 to 0.6 mm thick thin multilayer boards were gradually popularized. The part guide hole and shape are completed by punching processing. In addition, some small and diverse products use a photoresist to form patterns.

High power amplifier-base material: ceramic + FR-4 sheet + copper base, layer number: 4 layers + copper base, surface treatment: immersion gold, characteristics: ceramic + FR-4 sheet mixed lamination, with copper base compaction.

Military high frequency multilayer board-base material: PTFE, board thickness: 3.85mm, layer number: 4 layers, features: blind buried holes, silver paste filling holes.

Green product-Base material: environmentally friendly FR-4 sheet, plate thickness: 0.8mm, number of layers: 4 layers, size: 50mm × 203mm, line width / space: 0.8mm, hole diameter: 0.3mm, surface treatment: Shen Jin, Shen Tin.

High frequency, high Tg device-base material: BT, number of layers: 4 layers, board thickness: 1.0mm, surface treatment: gold.

Embedded system-substrate: FR-4, number of layers: 8 layers, board thickness: 1.6mm, surface treatment: tin spray, line width / space: 4mils / 4mils, solder mask color: yellow.

DCDC, Power Module-Base material: High Tg thick copper foil, FR-4 sheet, size: 58mm × 60mm, line width / space: 0.15mm, aperture: 0.15mm, board thickness: 1.6mm, number of layers: 10 layers , Surface treatment: Shen gold, Features: Thickness of each layer of copper foil 3OZ (105um), blind buried hole technology, high current output.

High-frequency multilayer board-substrate: ceramic, layer number: 6 layers, board thickness: 3.5mm, surface treatment: immersion gold, features: buried holes.

Photoelectric conversion module-substrate: ceramic + FR-4, size: 15mm x 47mm, line width / space: 0.3mm, aperture: 0.25mm, number of layers: 6 layers, board thickness: 1.0mm, surface treatment: gold-plated Gold finger, features: embedded positioning.

Backsheet-Base material: FR-4, number of layers: 20 layers, board thickness: 6.0mm, outer layer copper thickness: 1/1 ounce (OZ), surface treatment: heavy gold.

Miniature module-base material: FR-4, layer number: 4 layers, board thickness: 0.6mm, surface treatment: immersion gold, line width / space: 4mils / 4mils, features: blind hole, semi-conducting hole.

Communication base station-base material: FR-4, layer number: 8 layers, board thickness: 2.0mm, surface treatment: tin spray, line width / space: 4mils / 4mils, features: dark solder mask, multiple BGA impedance control.

Data Collector-Base Material: FR-4, Layers: 8 Layers, Board Thickness: 1.6mm, Surface Treatment: Immersion Gold, Line Width / Pitch: 3mils / 3mils, Solder Mask Color: Green Matt, Features: BGA , Impedance control. ^[2]