What Are the Different Types of Heat-Insulating Materials?
Thermal insulation material, a material that can block the transfer of heat flow, is also called thermal insulation material. Traditional thermal insulation materials, such as glass fiber, asbestos, rock wool, silicate, etc., new thermal insulation materials, such as aerogel felt, vacuum plate, etc.
Insulation materials
- Insulation materials are divided into
- There are three ways for heat transfer in building heat exchange: conductive heat + convective heat <25%, radiant heat> 75%.
- After the temperature of the tile roof rises in summer, a large amount of radiant heat enters the room, causing the temperature to continue to rise, and the working and living environment is extremely uncomfortable.
- Dike aluminum foil
- Aluminum foil insulation coil concept
- Dike aluminum foil heat insulation coil, also known as barrier film, heat insulation film, heat insulation foil, heat extraction film, reflection film, etc. It is composed of aluminum foil veneer + polyethylene film + fiber braid + metal coating film laminated with hot melt adhesive. The aluminum foil coil has the functions of heat insulation, water resistance, moisture resistance and so on. Aluminum foil insulation coils have extremely low solar absorption (solar radiation absorption coefficient) (0.07), have excellent thermal insulation properties, can reflect more than 93% of radiant heat, and are widely used in building roofing and exterior wall insulation Insulation.
- Several thermal insulation materials with low thermal conductivity (divided by thickness)
- 1. Thermal insulation paper: FiberGC-10 ~ 50 series thermal insulation paper has a thermal conductivity of 0.027 WmK, thickness of 0.4 ~ 5mm, white, paper-like, with ultra-thin advantages. It is often used in IT small electronic products and home appliances. Rarely used in building insulation;
- 2. Glass fiber cotton board / felt: 0.035 watts thermal conductivity, thickness 3mm ~ 5mm, white, divided into hard board and soft felt, glass fiber structure, used for home appliances, pipes, etc .;
- 3. Polyurethane foam board (PU / PIR): thermal conductivity 0.02 ~ 0.035 WmK, multi-color, hard, brittle, thickness 10mm ~ 200mm;
- 4. Centrifugal stripped fiber cotton / rock wool: Thermal conductivity is generally 0.038 WmK, thickness is 30 ~ 200mm, yellow, used in construction industry, machine room, warehouse, etc .;
- 5. Micro-nano insulation board: thermal conductivity of 0.02 WmK, high temperature resistance, mostly used in high temperature environments;
- 6. Aerogel felt: thermal conductivity at normal temperature 0.018W / (K · m), thickness 2mm ~ 10mm, white or blue, flexible felt, can be customized into rigid plate-like material according to requirements, suitable for equipment and pipeline insulation.
- Free-formable insulation material
- RFC shaped insulation.
- New efficient drying technology
- Due to its poor thermal conductivity, traditional heat-air drying takes a long time and consumes too much energy, resulting in poor drying uniformity. Microwave drying technology bypasses the problem of poor heat transfer performance and improves Production efficiency meets the requirements of modern industrial production for high efficiency, energy saving and environmental protection. It solves the problems of long drying time, slow capital turnover and uneven drying of traditional insulation materials. The specific characteristics are:
- The drying process is fast and rapid. Deep drying can be completed within a few minutes, which can make the final moisture content reach more than one thousandth
- Dry evenly and the product has good drying quality;
- High efficiency, energy saving, safety and environmental protection;
- The thermal inertia is small, and the immediateness of heating is easy to control.
- synotherm is a world-renowned manufacturer of industrial microwave kiln equipment and a provider of microwave heating solutions. It specializes in the production of high-quality microwave drying equipment and high-temperature microwave sintering furnaces. See [1] for details