What is the micromachinization of the surface?

surface micromachinization is a production process used to develop integrated circuits and sensors of different types. The use of techniques of micromachining surfaces allows application up to almost 100 finely applied layers of circuit patterns on one chip. For comparison, only five or six layers are possible using standard micromachinings processes. This allows many other features and electronics to be included in each chip for use in motion sensors, accelerometers that deploy airbags in the vehicle crash, or for use in gyroscopy navigation systems. Surface micromachining uses selected materials and processes of wet and dry etchings to create layers of the perimeter. Surface micromachinated sensors in vehicles also provide protection against inverting through tilt control and are used in anti-blocker brake systems. These circuits are also used in high -ordering gyroscopes in control and navigation systems. Given the fact that the circuits of PRSummed by this method creates small and precise circuits, it is possible to combine multiple functions on one chip for use when sensing movement, stream sensing and in some consumer electronics. In the photo, when filming with a camcorder, these chips provide image stabilization during movement.

The surface micromachinization process uses either crystal silicon chips substrates as a base on which layers can be created or can be lowered on a cheaper glass or plastic substrates. The first layer is usually made of silicon, insulator, which is etched to the desired thickness. Through this layer, a photo -sensitive film layer is applied and ultraviolet (UV) light is applied. Furthermore, this wafer is developed, rinsed and baked for the following etching process. This process is repeated by multiple layers, with careful monitoring and precise etching technologyApplied to each layer to create a final layered chip design.

The actual process of micromachining of the surface is performed once or by combining several machining processes. Wet etching is carried out by means of hydrophluoric acids to improve the structures of the circuits on the layers and cut the unprotected insulation materials; The non -lean areas of this layer are then electrolysed to insulate the layer from the next used. Dry etching can be done separately or in combination with chemical etching using ionized gas to bombing areas to be etching. Manufacturers use dry plasma etching when a large part of the layer is to be etched in the design of the circuit. In addition, another plasma combination of chlorine with fluorine gas can produce deep vertical sections through the film masking materials of the layer, as is often necessary in the manufacture of chips of the microactuator sensor.