What Is a DIP Socket?

Dual in-line package (English: dual in-line package ) also known as DIP package or DIP package , referred to as DIP or DIL , is an integrated circuit packaging method, the shape of the integrated circuit is rectangular, on both sides of the package There are two rows of parallel metal pins called pin headers. The components of the DIP package can be soldered in the through holes of the printed circuit board plating, or inserted into the DIP socket.

The DIP packaged CPU chip has two rows of pins and needs to be inserted into a chip socket with a DIP structure. Of course, it can also be directly inserted on a circuit board with the same number of solder holes and geometrical arrangement for soldering. When inserting and removing the DIP packaged chip from the chip socket, special care should be taken to avoid damaging the pins. DIP package structure forms are: multilayer ceramic dual in-line DIP, single-layer ceramic dual in-line DIP,

The package of a DIP chip is generally made of plastic or ceramic. The ceramic package has good air tightness and is often used in equipment that requires high reliability. However, most dual in-line packaged chips are made of thermosetting resin plastic. With a curing cycle of less than 2 minutes, hundreds of chips can be produced.

Common DIP package conforms

As shown in the figure on the right, when the component's recognition gap is facing up, the uppermost pin on the left is pin 1, and the other pins are numbered in a counterclockwise order. Sometimes pin 1 is also marked with a dot.

For example, for the IC of DIP14, when the identification gap is upward, the pins on the left are pins 1 to 7 from top to bottom, and the pins on the right are pins 8 to 14 from bottom to top.

Suitable for PCB (printing

A chip using this packaging method has two rows of pins, which can be soldered directly on a chip socket with a DIP structure or soldered in the same number of solder holes. Its feature is that it can easily achieve through-hole welding of PCB boards and has good compatibility with the motherboard. But because of

DIP package

The package area and thickness are relatively large, and the pins are easily damaged during insertion and removal, and the reliability is poor. At the same time, due to the influence of the process, this package method generally does not exceed 100 pins. With the high degree of integration inside the CPU, DIP packaging quickly exited the stage of history. Their "footprint" can only be seen on older VGA / SVGA graphics cards or BIOS chips.