What are the different applications of thin film silicon?

There are dozens of different methods for storing thin film silicon, but in general they can be divided into three categories. There are processes of deposition of chemical reaction, such as deposition of chemical vapors, epitaxes of molecular beam and electrodeposition. Physical deposition of steam is a deposition process in which a physical reaction occurs. There are also hybrid processes that use both physical and chemical agents that include spray deposits and gas or glow methods.

The physical deposition of steam is related to the diversity of used spray technologies and includes evaporation of the material from the source and transfer to the silicone layers to the target substrate. The source material evaporates in the vacuum chamber, causing the particles to disperse and annoy all surfaces in the chamber. For this, two methods of using physical deposition of steam are electron beams or e-fans for heating and evaporating the source material or resistance evaporation use of high electricstream. The spray deposition uses partial vacuum loaded with inert but ionized gas, such as Argon, and charged ions are attracted to the target materials used, which will tear atoms that settles on the substrate as silicon of thin films. There are many different types of spraying, including reactive ion, magnetor and cluster beam, all variations on how ion bombing of source material is done.

Chemical deposition of par is one of the most common processes used to produce thin film silicon and is more accurate than physical methods. The reactor is filled with a number of gases that interact with each other to create solid by -products that condense on all surfaces in the reactor. Silicon made of thin films created in this way can have extremely uniform properties and very high purity, causing this method useful for SemicoNductor industry and also in the production of optical coatings. The disadvantage is that these types of deposition methods can be relatively slow, often require reaction chambers operating at temperatures up to 2,012 ° Fahrenheit (1100 ° Celsius) and use very toxic gases such as Silne.

Each of the dozens of different deposition processes must be taken into account in the production of thin film silicon, because everyone has its own unique benefits, costs and risks. Soon reactive ion chambers were suspended from the laboratory bottom to insulate them because they had to be charged to 50,000 volts and could shorten computer equipment, even though they were just sitting on the concrete nearby. Copper pipes with a diameter of the twelve -inch diameters that ran from these reactors to the subsoil under the production floor were colloquially known as "Jesus' wands" by laboratory workers, referring to the fact that anyone who touches him will talk to Jesus because he would kill him. Products such as a dye sensitized Socrearies offer new, less or less or less or lessA shorter and cheaper approach to making thin films because they do not require accurate silicone semiconductor substrates and can be produced at a much lower temperature of approximately 248 ° Fahrenheit (120 ° Celsius).