What Is Wire Bonding?

Wire bonding (Wire Bonding) is a method that uses thin metal wires and uses heat, pressure, and ultrasonic energy to tightly bond metal leads to substrate pads.

Wire bonding

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Wire bonding (Wire Bonding) is a method that uses thin metal wires and uses heat, pressure, and ultrasonic energy to tightly bond metal leads to substrate pads.

Wire bonding (Wire Bonding) is a method that uses thin metal wires and uses heat, pressure, and ultrasonic energy to tightly bond metal leads to the pads of the substrate to achieve electrical interconnection between the chip and the substrate and information exchange between the chips. Under ideal control conditions, electron sharing or interdiffusion of atoms occurs between the lead and the substrate, thereby enabling atomic-level bonding between the two metals.

The purpose of wire bonding is to introduce and derive electrical connections from the core components. In the industry, three wire bonding positioning platform technologies are commonly used: thermocompression wire bonding, - ultrasonic wire bonding, and thermoacoustic wire bonding.