What is the wires?

In the nominal value, the "wire joining" would seem to be just another term for welding, but this process is actually a bit more complicated because the added variables are involved. The wire binding process is carried out on electronic devices to permanently join different components, but due to the project of the project, only gold, aluminum and copper are usually used because of their conductivity and relative binding temperature. This method is completed by using a ball link or wedge connection technique that combines low heat, ultrasonic energy and trace amounts of pressure to prevent the electronic circuit. The microchip or the corresponding pad can be easily damaged by incorrect design, so practicing on a previously damaged or one -time chip is highly recommended before one attempt at a binding wire. Voptimal environment, up to 10 links per second. This method varies slightly for each type of metal used due to their appropriate elementary properties. Usually usedTwo types of wire bonds are balls and wedge bond.

Although the best choice for ball binding is pure gold, copper has become a popular alternative due to its relative costs and availability. This process requires a device similar to needle, not too different from what the seamstress would use to hold the conductor in place while the extremely high voltage is applied. The voltage along the surface causes the molten metal to form into the shape of the ball, ie the name of the process. When copper is used for binding balls, nitrogen is used in gaseous form to prevent copper oxide during the connecting wire procedure.

WEDGE LouNG uses a tool to create pressure on the wire because it is an application to the microchip. After the wire is safely held in place, ultrasonic energy is applied to the surface and a fixed bond is formed in several areas. The wedge connection requires almost twice the time to pSaccken ball bond, but is also considered a much more stable connection and can be completed with aluminum or several other alloys and metals.

amateur is not recommended to try to either glue the ball or to the wedge gluing without the first acceptance of the correct instructions, due to the sensitive nature of the wire binding and the risk associated with damage to the electrical circuits. The technology that has been developed allowed both these processes to be completely automated and the wire bonds are rarely completed manually. The final result is a much more accurate connection that tends to survive those that create manual bonds by traditional manual binding methods.