What are the different types of gold plating solutions?
Gold plating solution was usually composed of liquid electronist compounds including dangerous chemical cyanide associated with gold in solution. Alternatives are the use of gold nitrides, which have traditionally proved to be difficult to synthesize, but have now been improved using methods of ion implantation. Mechanical plating barrels and brushes are other alternatives to the electro-work method traditionally used for gold plate on the surface. Gold slows slowly in the presence of infused atoms of copper, silver or nickel, which are used as substrates on which it is plain. For this reason, for jewelry applications, elements that show the smallest tend to migrate and dirty gold like copper above the silver, immediately below the surface of gold. With components used for electrical purposes, where durability is more important, nickel is used as an immediate substrate material to add physical force to plating.
Electroplating processes will vary highly in speed based on the concentration of gold in the entire electrolyte compound and the actual chemical composition of the gold plating solution itself. A typical electroly solution can store around one micron gold to the surface per minute, with layers of up to 100 microns in thickness. On the other hand, forms of electronic golden plating, which immerses a part of nickel -based solution, offers more even gold coatings with a much longer life, but a maximum thickness of 10 microns. The immersion solutions also have a much shorter lifetime than typical electronic solutions, so technology without electroly/immersion is usually used for a plate of fine electrical components. Although the electrical level usually required a conductive surface to the golden plate, it is now possible for the plastic to be plastic first etching the plastic and by coating the palladium metal.
Gold compounds based on nitride are another form of gold plating solution. RoleThe gold nitride nitride nitride considered better for electronic applications due to reduced costs and better durability replaces the need for gluing gold to toxic elements such as arsenic and cyanide, and metals such as nickel, cobalt or iron. The nitrides are generated using an ion pistol to implant nitrogen atoms in gold crystals under a high vacuum. The resulting gold coating is heavier than traditional industrial plating and has no toxic elements that can damage the environment when the component is destroyed later. Research on other types of gold plating solution is constantly evolving to eliminate the practice of using toxic metal alloys, which can potentially pollute groundwater when old electtoric components are destroyed in landfills.