What are semiconductor wafers?

semiconductor wafers are 4 to 10 inches (10.16 to 25.4 cm) in diameter round discs that carry external semiconductors during production. They are a temporary form of positive semiconductors (P) type or negative semiconductors type (N). Silica wafers are very common semiconductor wafers, because silicon is the most popular semiconductor, thanks to its abundant offer on the planet. The semiconductor wafers are the result of slicing or cutting off the thin disk from the ingot, which is a rod -shaped crystal that has been doped as a type P or N. This suggests why Die X-Y has the creation of similar patterns that bears the matrix and in fact contain the entire electronic circuit. Later in the production line, these will die on the lead frame ready to glue small wires from the dieseleating into the legs or pegs of integrated circuits.

Before slicing a semiconductor wafer into the head, there is an opportunity to test numerous die, which bears with automated testers of steps that gradually place test probe into microscopic terminal points on DIE to pour, stimulate and read relevant test points. This is a practical approach, because the defective matrix will not be packed in the finished component or integrated circuit to be rejected during the final testing. Once the matrix is ​​considered defective, the ink brand emits to die for easy visual segregation. A typical goal is that the million died of less than six diesels. Trade is other factors that need to be considered, so the recovery rate is optimized.

Quality systems ensure that the recovery rate in DIES is acceptably high. Dies on the edges of the wafers will often be partially errorsět. Real production of the circuit on the matrix requires time and resources. In order to slightly simplify this highly complicated methodology of production, most countries on the edges are no longer processed to save the total costs of time and resources.